Japanese semiconductor maker Rapidus is to set up a research and development center for so-called back-end manufacturing processes in the northern prefecture of Hokkaido.
The company is aiming at domestic production of cutting-edge semiconductors and plans to begin post-processing R&D in Chitose City in April 2026.
Back-end processes include separating the circuit etched on wafers, and assembling those pieces into products.
Rapidus is building a manufacturing plant in Chitose. It plans to operate pilot lines in April next year, with a view to beginning mass production in 2027.
The company is already conducting research and development of front-end processes, such as etching delicate circuit patterns on wafers.
A groundbreaking ceremony for the new R&D center was held on Thursday. A clean room of about 9,000 square meters will be set up inside Seiko Epson’s Chitose plant which is located next to the Rapidus manufacturing site.
Rapidus faces the challenges of developing mass production technology for cutting-edge chips, securing large-scale investment, and winning customers.
Rapidus President Koike Atsuyoshi said the technology is not simple, but development has been progressing as scheduled. He said Rapidus is currently in negotiations with about 40 companies that are potential customers.